PCB Manufacturing Capabilities
From 2-layer prototypes to 20-layer HDI builds with blind, buried and laser microvias — SmartFab partners with audited fabrication houses that match your tolerance, finish and IPC class requirements.
Layer Count & Stackup
Single-sided through 20-layer rigid, HDI sequential lamination, and rigid-flex hybrids. Custom stackups with target impedance available.
Materials
FR-4 standard and high-Tg, Rogers low-loss laminates, aluminum MCPCB for thermal management, and polyimide flex / rigid-flex constructions.
Surface Finishes
Lead-free HASL through ENEPIG and hard gold for edge connectors. Choose by solderability, flatness, shelf life and end-use environment.
Trace / Space & Drill
Down to 2/2 mil trace/space and 0.1 mm laser microvias for HDI builds. Standard tolerances are quoted with no upcharge.
Via Technology
Through-hole, blind, buried, laser microvia, stacked microvia and plated-shut filled vias for high-density designs.
Quality & Compliance
IPC-A-600 Class 2 standard, Class 3 and Class 3A medical builds available. ISO 9001 and UL certified partner facilities.
Board Thickness & Copper
0.4 mm to 3.2 mm board thicknesses. Heavy copper up to 4 oz outer for power and motor-control applications.
Lead Time
Standard 10-business-day fab through 24-hour rush. Honest lead times — we tell you up front when a date is at risk.
Special Capabilities
Beyond standard fabrication, SmartFab routinely runs builds with these advanced features.
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