Rigid
8-Layer Rigid PCB
Multilayer rigid board with deep blue solder mask, ENIG gold pads, and a fine-pitch BGA escape. Built for high-speed digital and dense routing.
- 8 layers
- ENIG finish
- BGA escape
- 4 mil trace/space
Product Gallery
Boards we build, up close
Rigid, flex, HDI, multilayer, and full assemblies. Every sample below was built to a real customer spec — and reviewed by an IPC-certified engineer before fabrication.
Up to 32 layers
Rigid, flex, rigid-flex
HDI & microvias
Any-layer, stacked, staggered
Controlled impedance
±10% or tighter
3 mil trace/space
Fine-pitch BGA capable
Sample boards
A cross-section of the work that comes off our line each week. Pick a category — we'll build to your gerbers and stackup.
Flex
Flex Circuit
Polyimide flex circuit with rolled-anneal copper traces and gold contact fingers. Bends through tight radii without fatigue.
- Polyimide
- Dynamic flex
- Gold fingers
Assembly
Compact PCBA
Fully populated SMT assembly shown next to a US quarter for scale. Buck regulators, MCU, passives — built to spec, tested before shipment.
- Turnkey SMT
- AOI tested
- Quarter for scale
HDI
HDI Microvia Board
High-density interconnect with stacked microvias and ultra-fine routing under a fine-pitch BGA. The architecture behind modern phones, wearables, and SDR.
- Microvias
- Any-layer HDI
- 3 mil features
Multilayer
Multilayer Stackup
Twelve-layer impedance-controlled board with matte black solder mask and gold edge fingers. Stackup engineered for signal integrity.
- 12 layers
- Impedance control
- Edge plating
Finishes
Solder Mask Palette
Standard green, plus white, blue, red, yellow, purple, and matte black on request. Match your brand or your enclosure — color is yours to choose.
- 7+ colors
- Matte or gloss
- White silkscreen
Got a board in mind?
Price your build in minutes with our instant quote tool. Every order gets a free DFM review by an IPC-certified engineer before fabrication.